Flexible Cooling Solutions for High Heat Density Systems
High density modular cooling systems deliver energy-efficient and flexible cooling solutions for data centers with more than 30kW per rack. They are available in open or closed architecture and pumped refrigerant-based or water-based technology. These solutions allow expansion without interruption of cooling operations using optional pre-charged flexible piping with threaded quick connect fitting.
Refrigerant-based units are best to use around electronic equipment as they operate at low pressure in the piping circuit and become gas at room conditions. They support a hot aisle/cold aisle approach. They come in floor-mount, rack-mount and ceiling-mount configurations so they require little or no floor space.
Water-based cooling solutions come in rack enclosures or door-mounted models. They leverage the building’s current chilled water system. They offer an alternative heat removal solution to critical applications where the hot aisle/cold aisle approach to cooling is not practical.
Some of these units have easily-installed rack fan unit to provide airflow and energy-efficient design.
High Density Modular Cooling Systems are designed for high density equipment requiring precise cooling and protection, communication enclosure, data centers and servers.
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The traditional cooling approach considers open aisle architectures with return air temperatures to cooling units between 22-26°C and supply air temperatures to the data center between 10-14°C to be considered standard.
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