Vertiv™ Liebert® XDU Coolant Distribution Units
Designed to support liquid cooling within high density environments, the Liebert® XDU Coolant Distribution Units are suitable for chip & rear door cooling applications that offer easy, cost-effective deployment in any data center. The Liebert XDU family offers systems that operate with/without facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
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- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
Vertiv™ Liebert® XDU Coolant Distribution Units
Designed to support liquid cooling within high density environments, the Liebert® XDU Coolant Distribution Units are suitable for chip & rear door cooling applications that offer easy, cost-effective deployment in any data center. The Liebert XDU family offers systems that operate with/without facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
Specifications
As data centers adopt liquid cooling, fitting in new cooling distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ Liebert® XDU simplifies your work with the flexibility to support rear door heat exchangers or direct contact liquid cooling. The Liebert® XDU’s compact footprint allows for end of row or perimeter placement. However, and wherever you incorporate the Liebert XDU, you can easily distribute coolant to efficiently manage power-dense hot spots liquid to liquid up to 450 kW or 1,368 KW. Compact footprint for deployment flexibility within the row or perimeter; Efficient Cooling Distribution to manage power-dense hot spots and up to 450 kW or 1,368 kW; Precise Temperature Control to eliminate thermal shock for server CPU and GPUs; Redundant Pumps and Dual Power Feeds for optimizing reliable operation; Remote Monitoring available through communications with HTTP, SNMP, RS-485 Modbus, Modbus IP.
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